Heat sink equipped with a vapor chamber

ABSTRACT

A heat sink equipped with a vapor chamber includes a heat conduction plate and a vapor chamber. The heat conduction plate has one side formed integrally a plurality of radiation fins and another side with two lateral edges formed respectively and integrally a fastening portion. The two fastening portions are interposed by a recess to bond the vapor chamber. Each fastening portion is fastened to a printed circuit board through at least one screw to allow the vapor chamber to contact a heat generation element. The fastening portion is integrally formed at a desired thickness, thus has sufficient strength to withstand the fastening force of the screw to prevent tight sealing between the vapor chamber and heat generation element affected by deformation of the heat conduction plate. Thereby the vapor chamber can smoothly contact the heat generation element to rapidly transfer heat outside.

FIELD OF THE INVENTION

The present invention relates to a heat sink and particularly to a heatsink equipped with a vapor chamber.

BACKGROUND OF THE INVENTION

Please refer to FIG. 1, a conventional heat sink includes a heatconduction plate 1 and a vapor chamber 2. The heat conduction plate 1has one side formed a plurality of radiation fins 3 and another sidebonded to the vapor chamber 2, and two lateral sides fastened to aprinted circuit board (PCB in short, not shown in the drawing) throughat least one screw 4. The vapor chamber 2 is in contact with a heatgeneration element (not shown in the drawing) of the PCB, and is hollowand vacuumed to seal heat transfer fluid 5 (pure water) inside which canrapidly transfer heat through phase transition between liquid and gasstates. Hence the heat generated by the heat generation element can bequickly spread by the vapor chamber 2 to the radiation fins 3 todissipate the heat to lower the temperature.

To save material, reduce weight and also accelerate heat transfer, theheat conduction plate 1 usually is fabricated at a small thickness.Hence when the heat conduction plate 1 is fastened to the PCB at the twolateral sides through the screws 4, the fastening force tends to causedistortion and deformation of the heat conduction plate 1 that couldalso result in deformation of the vapor chamber 2 without closelycontacting the heat generation element. As a result, heat transfereffect suffers.

Moreover, a gap is easily generated between the vapor chamber 2 and heatconduction plate 1 due to the aforesaid deformation. That alsodiminishes the heat transfer effect and slows heat transfer from thevapor chamber 2 to the heat conduction plate 1. All these hamper heatdissipation effect of the heat sink.

SUMMARY OF THE INVENTION

Therefore, the primary object of the present invention is to provide aheat sink that can quickly and effectively transfer heat outside toachieve desired cooling effect.

To achieve the foregoing object, the present invention provides a heatsink equipped with a vapor chamber. The heat sink includes a heatconduction plate and a vapor chamber. The heat conduction plate has oneside formed integrally a plurality of radiation fins and another sidewith two lateral edges formed respectively and integrally a fasteningportion. The two fastening portions are interposed by a recess to bondthe vapor chamber.

The fastening portion is fastened to a PCB through at least one screw tomake the vapor chamber in contact with a heat generation element. As thefastening portion is formed integrally at a desired thickness, it has asufficient strength to withstand the fastening force of the screw, thustight sealing between the vapor chamber and heat generation elementaffected by deformation of the heat conduction plate can be prevented,and the vapor chamber can smoothly contact the heat generation elementto quickly and effectively transfer heat outside.

The foregoing, as well as additional objects, features and advantages ofthe invention will be more readily apparent from the following detaileddescription, which proceeds with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of a conventional heat sink equipped with avapor chamber.

FIG. 2 is an exploded view of the invention.

FIG. 3 is a perspective view of the invention.

FIG. 4 is an exploded view of another embodiment of the invention.

FIG. 5 is a sectional view of another embodiment of the invention.

FIG. 6 is a sectional view of yet another embodiment of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 2 and 3, the present invention aims to provide aheat sink equipped with a vapor chamber. The heat sink includes a heatconduction plate 10 and a vapor chamber 20. The heat conduction plate 10has one side formed integrally a plurality of radiation fins 30 andanother side with two lateral edges formed respectively and integrally afastening portion 40. The two fastening portions 40 are interposed by arecess 50 to bond the vapor chamber 20. Each fastening portion 40 has atleast one aperture 41 run through by at least one screw 60 coupled witha spring 61 to fasten to a printed circuit board (PCB in short, notshown in the drawings) to allow the vapor chamber 20 in contact with aheat generation element (not shown in the drawings).

Refer to FIGS. 4 and 5 for another embodiment of the invention. The heatconduction plate 10 has a latch flange 52 respectively on a front sideand a rear side of the recess 50, and an airtight compartment 51 dugdownwards. The vapor chamber 20 is positioned and surrounded by the twolatch flanges 52 and the two fastening portions 40 to cover and seal theairtight compartment 51. The heat conduction plate 10 has an airextraction vent 11 communicating with the airtight compartment 51 toextract air therefrom and inject into a heat transfer fluid 70 which canbe pure water capable of quickly transferring heat through phasetransition between liquid and gas states of the heat transfer fluid 70.The vapor chamber 20 also has a sealed compartment 22 holding heatconduction fluid 71 to quickly transfer heat through phase transitionbetween liquid and gas states of the heat conduction fluid 71 to rapidlytransfer heat from the vapor chamber 20 to the heat conduction plate 10.

Refer to FIG. 6 for yet another embodiment of the invention. The vaporchamber 20 further includes a plurality of heat conduction fins 21extended into the airtight compartment 51 to contact the heat transferfluid 70 to increase the contact area with the vapor chamber 20, therebyto further enhance heat transfer effect to better meet use requirements.

By means of the structures set forth above, the fastening portion 40 isintegrally formed at a desired thickness, thus has sufficient strengthto withstand the fastening force of the screw 60 to prevent tightsealing between the vapor chamber 20 and heat generation elementaffected by deformation of the heat conduction plate 10, thus the vaporchamber 20 can smoothly contact the heat generation element. With rapidheat transfer of the heat conduction fluid 70, heat transfer effect canbe further enhanced to meet use requirements.

1. A heat sink equipped with a vapor chamber, comprising: a heatconduction plate which includes one side formed integrally a pluralityof radiation fins and another side with two lateral edges formedrespectively and integrally a fastening portion, the two fasteningportions being interposed by a recess; and a vapor chamber being bondedto the recess.
 2. The heat sink of claim 1, wherein the heat conductionplate includes a latch flange respectively on a front side and a rearside of the recess and an airtight compartment dug downwards, such thatthe vapor chamber is positioned and surrounded by the two latch flangesand the two fastening portions to cover and seal the airtightcompartment.
 3. The heat sink of claim 2, wherein the vapor chamberincludes a plurality of heat conduction fins extended into the airtightcompartment.
 4. The heat sink of claim 2, wherein the heat conductionplate includes an air extraction vent communicating with the airtightcompartment.
 5. The heat sink of claim 1, wherein each fastening portionincludes at least one aperture run through by at least one screw.
 6. Theheat sink of claim 5, wherein the screw is coupled with a spring.